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IEICE Transactions on Electronics 2006 E89-C(7):906-912; doi:10.1093/ietele/e89-c.7.906
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Copyright © 2006 The Institute of Electronics, Information and Communication Engineers

Special Section on Heterostructure Microelectronics with TWHM2005 -- Papers -- GaN-Based Devices

Review of Recent Developments in Growth of AlGaN/GaN High-Electron Mobility Transistors on 4H-SiC by Plasma-Assisted Molecular Beam Epitaxy

Andrea CORRION1, Christiane POBLENZ1, Patrick WALTEREIT1, Tomas PALACIOS2, Siddharth RAJAN2, Umesh K. MISHRA2 and Jim S. SPECK1

1 The authors are with Materials Department, University of California, Santa Barbara CA 93106, USA. E-mail: acorrion{at}engineering.ucsb.edu, 2 The authors are with Electrical and Computer Engineering Department, University of California, Santa Barbara CA 93106, USA.

In this paper we review our recent work developing the growth of AlGaN/GaN high-electron mobility transistors (HEMTs) grown on SiC (0001) by plasma-assisted molecular beam epitaxy (PA-MBE). State-of-the-art AlGaN/GaN HEMTs have been achieved using MBE-grown material. Buffer leakage was an important limiting factor for early devices. We have shown that by appropriately controlling the Al/N flux ratio during growth of the nucleation layer on SiC(0001), low-leakage GaN buffers can be subsequently grown. In addition, a "modulated growth" technique was developed to achieve large area uniformity and surface morphology control. High-performance HEMTs were fabricated utilizing these two techniques. On 200 nm gate-length devices, at 4 GHz an output power density of 8.4 W/mm was obtained with a power-added efficiency (PAE) of 67% at a drain bias of 30 V. At a higher drain bias (42 V), 13.7 W/mm with a PAE of 55% was achieved.

Key Words: MBE, Gallium Nitride, HEMT, microwave, MBE


Manuscript received November 8, 2005.


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